Master Bond
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio—exceeding 6 W/(m·K)—it delivers exceptional heat dissipation while remaining electrically non-conductive and compliant with ASTM E595 NASA low outgassing requirements.
Formulated with a specialty filler featuring a particle size range of 5–30 microns, EP54TC supports thin bond lines and efficient void filling to maximize thermal performance. It offers an exceptionally low thermal resistance of 5–7 × 10-6 K·m2/W and a high tensile modulus exceeding 1,000,000 psi at room temperature. This robust system is serviceable from –100°F to +400°F (–73°C to +204°C) and, when post-cured, achieves a glass transition temperature of 70–80°C and a Shore D hardness of 85–95.
EP54TC is a moderate heat cured system, with a recommended schedule of 2 hours at 80°C followed by a 2–4 hour post cure at 90–125°C. The mixed material features a viscosity of 100,000–200,000 cps and offers a manageable working life of 60–90 minutes at ambient temperature. To accommodate both research and large-scale manufacturing, EP54TC is available for purchase in ounce, half-pint, pint, quart, and gallon kits.